Laser Hermetic Sealing In Electronic Packaging

Precision welding in the electronics industry presents unique complexities due to the presence of delicate components within protective enclosures. Our systems employ isolated welding chambers to achieve contamination-free electronic packaging, delivering superior hermetic integrity for sensitive device housings.

Electrical component assembly demands specialized methodologies. Uncontrolled current leakage risks damaging microelectronics, while conventional joining processes expose assemblies to thermal/electrical stresses that degrade PCB reliability. Precision laser welding systems overcome these limitations through localized energy delivery, minimizing heat dispersion near critical circuits—an impossibility with through-hole soldering techniques.

Oxidative degradation from ambient exposure compromises metallurgical properties and enclosure functionality, potentially inducing short circuits. Our inert gas atmospheres not only suppress oxidation during welding but enable permanent inert gas encapsulation within sealed cavities, outperforming traditional epoxy sealing in long-term stability. The process accommodates dissimilar metals and crack-prone alloys, expanding material selection flexibility for optimized package designs.

Extreme operational environments—including thermal cycling and high-pressure conditions—mandate uncompromising durability. Laser-sealed joints demonstrate exceptional mechanical resilience, surpassing organic adhesives and mechanical fasteners in lifespan. Integrated automation ensures micron-level repeatability, enabling high-throughput production of mission-critical electronic assemblies.