Laser Hermetic Sealing In Semiconductor

In semiconductor manufacturing ecosystems, laser welding has emerged as a critical enabling technology for precision joining. This non-contact energy transfer process achieves micro-scale fusion connections, meeting stringent requirements for thermal management, cleanliness, and reliability in semiconductor equipment manufacturing and packaging/testing processes.

Semiconductor Welding Process Selection
Characteristic Resistance Welding TIG Welding Laser Welding
Heat Control
Localized hotspots
High heat input
Precise micro-zone thermal management
Material Compatibility
Conductive materials only
Limited dissimilar metals
Multi-material adaptability
Automation Integration
High automation
Complex fixtures required
Seamless system integration
Cleanliness Assurance
Debris generation
Shielding gas dependent
Inert environment compatible
Advantages of Semiconductor Laser Welding
Thermal-Sensitive Component Protection
  • Precise heat input optimization
  • Heat-Affected Zone (HAZ) controlled below substrate critical temperature
  • Prevention of PN junction damage and lattice alterations
Complex Material Compatibility
  • Overcoming welding challenges for high-reflectivity materials (Cu/Mo/Kovar)
  • Hermetic sealing for dissimilar metal packages
  • Controlled metallurgical bonding at heterogeneous interfaces
Ultra-Clean Environment Adaptability
  • Class 100 cleanroom compatibility
  • Vacuum chamber-integrated welding processes
  • Spatter-free molten pool behavior
Micro-Joint Reliability
  • High-precision solder joint strength consistency
  • Micro-deformation precision control
  • Long-term welding stability
Related Equipment
Our Quality Management
Standardized process flow
  • Material testing
  • Welding pretreatment
  • Fixture positioning
  • Seal welding
  • Hermetic testing
Triple reliability verification

  • process monitoring

    Real time closed-loop control of welding energy; CCD monitoring system for molten pool morphology

  • Testing methods

    Metallographic analysis (weld penetration and defect detection); Helium mass spectrometry leak detection (sensitivity 5 × 10 ⁻13 Pa · m ³/s)

  • Environment Simulation

    Temperature shock test (-55 ℃) ↔+ 125 ℃ 1000 cycles); 85% RH humidity aging test (2000 hours)

Following standards
  • ASTM B209 Standard for Aluminum and Aluminum Alloy Plates
  • EN 485-2 Aluminum Welding Applicability Certification
  • AMS 2681E Aerospace Laser Welding Process Specification
  • MIL-STD-883 Method 1014 Sealing Test
  • GJB 548B-2005 Reliability of Microelectronic Devices
  • NADCAP Welding AC7114 Aerospace Special Process Certification
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