Technical Resources

Provide resources related to metal shell packaging

We are very willing to share all the resources related to metal shell airtight sealing. In the process of communicating with our customers, we learn from each other and make progress, which is very beneficial for both us and our customers

process database

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Our process database has accumulated a large amount of welding process data for different materials and products, which is a huge support for us to quickly and perfectly complete various strict requirements

Laser welding technology

This column delivers in-depth analysis of cutting-edge precision laser welding technologies, sharing critical process parameters and field-proven expertise for aerospace, semiconductor, implantable medical devices, and electronic packaging sectors. Focusing on complex scenarios involving stainless steel/aluminum/Kovar alloy/titanium/dissimilar metal joining, we dissect industry challenges—from porosity control to thermal distortion management and penetration stability—through JM Laser’s extensive engineering case studies, empowering engineers to tackle material compatibility and structural integrity challenges.

Poor welding

Defects that are prone to occur during welding are generally blackening, collapse, splashing, porosity, incomplete penetration, cracks, undercutting, gas leakage, etc.

Perfect welding

a smooth and flat weld seam, without welding defects such as cracks and pores, and can meet the corresponding airtightness requirements through helium mass spectrometry leak detection.

Related Reading

Technical Standard Library

Category Standard Application Industry Key Requirement Region
Materials
AMS 4911H
Aerospace Titanium
Aerospace/Defense
Tensile Strength≥895MPa
🇺🇸
JIS H 8602
Anodized Aluminum
Microwave
Coating Thickness 25±3μm
🇯🇵
KS D 6710
High-Si Aluminum
Automotive
Si Content 12-13%
🇰🇷
Welding
MIL-STD-2219D
Military Laser Welding
Defense
Depth-to-Width Ratio≥5:1
🇺🇸
DIN 32525-4
Laser Weld Quality
Industrial
Penetration Tolerance±5%
🇩🇪
JEITA ED-4703
Package Reliability
Semiconductor
1000 Temp Cycles<0.1% Fail
🇯🇵
Sealing Test
MIL-STD-750E
Military Fine Leak Test
Defense
He Leak Rate≤1×10⁻⁸ cc/s
🇺🇸
ESCC 9030
Space Hermetic Sealing
Aerospace
Dual Leak Test Verification
🇪🇺
KS B 0895
Helium Leak Test (KR)
General
Sensitivity≤1×10⁻⁷ Pa·m³/s
🇰🇷
High-Frequency
IPC-4103E
RF Laminates Performance
Microwave Circuits
Dk±0.05@10GHz
🌍
IEC 61189-5-503
Microwave Cavity Q Test
RF Components
0.1-40GHz Frequency Range
🌍
Industry Spec.
ISO 13485:2016
Medical Device QMS
Medical
Aseptic Welding Protocol
🌍
AS9100D
Aerospace QMS
Aerospace
Weld Parameter Traceability
🇺🇸
GJB 548C-2021
Military Thermal Shock
Defense
-65°C↔150°C 1000 Cycles
🇨🇳
MIL-STD-750E

The “Microelectronics Device Test Method Standard” issued by the US Department of Defense, in which Method 1071 is dedicated to helium mass spectrometry leak detection certification for high-value military devices, is the gold standard for military electronic packaging sealing testing

Military grade testing requirements
Comparison with Civil Standards
Parameter MIL-STD-750E ISO 3530
Sensitivity
1×10⁻⁸ cc/s He
5×10⁻⁸ Pa·m³/s
Calibration Frequency
Daily + Pre-Test Calibration
Weekly
Vacuum Integrity Verification
30-min Pressure Rise <5%
Not Specified
Data Integrity
Military-grade Audit Trail
Basic Electronic Records
Related interpretations
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